307
类别:CardEdge,EdgeboardConnectors,描述:CARDEDGELOPRO22POS.156GRN,系列:307,制造商:EDACInc,卡类型:非指定-单边,公母:母头,位__盘__排数:22,针脚数:22,卡厚度:0.062(1.57mm),排数:1,间距:0.156(3.96mm),特性:-,安装类型:通孔,端接:焊接,触头
DJT10E15
类别:圆形-外壳,描述:CONNHSGRCPTFLANGE12POSSKT,系列:MIL-C-38999系列I,DJT,制造商:TEConnectivity,引脚或插座:,连接器类型:母触点插座,类型:,针脚数:12,外壳尺寸_插件:15-97,尺寸:,外壳尺寸qqqMIL:-,线规:,触头端接:,触头类型:压接,端接:,触头尺寸:16(4),20(8),触头
AMM28DTBS
类别:CardEdge,EdgeboardConnectors,描述:CONNEDGECARD56POSR/A.156SLD,系列:-,制造商:SullinsConnectorSolutions,卡类型:非指定-双边,公母:母头,位__盘__排数:28,针脚数:56,卡厚度:0.062(1.57mm),排数:2,间距:0.156(3.96mm),特性:-,
GBC20DRES
类别:CardEdge,EdgeboardConnectors,描述:CONNEDGECARD40POS.100EYELET,系列:-,制造商:SullinsConnectorSolutions,卡类型:非指定-双边,公母:母头,位__盘__排数:20,针脚数:40,卡厚度:0.093(2.36mm),排数:2,间距:0.100(2.54mm),特性:-,
ECC36DJBB
类别:CardEdge,EdgeboardConnectors,描述:CONNEDGECARD72PS.100PRESSFIT,系列:-,制造商:SullinsConnectorSolutions,卡类型:非指定-双边,公母:母头,位__盘__排数:36,针脚数:72,卡厚度:0.062(1.57mm),排数:2,间距:0.100(2.54mm),特性:开
EEM06DRKF
类别:CardEdge,EdgeboardConnectors,描述:CONNEDGECARD12POS.156EXTEND,系列:-,制造商:SullinsConnectorSolutions,卡类型:非指定-双边,公母:母头,位__盘__排数:6,针脚数:12,卡厚度:0.062(1.57mm),排数:2,间距:0.156(3.96mm),特性:卡扩
RMC36DRSD
类别:CardEdge,EdgeboardConnectors,描述:CONNEDGECARD72POSDIP.100SLD,系列:-,制造商:SullinsConnectorSolutions,卡类型:非指定-双边,公母:母头,位__盘__排数:36,针脚数:72,卡厚度:0.093(2.36mm),排数:2,间距:0.100(2.54mm),特性:-,
FUYCONN,specializes
FUYCONNspecializesintheresearch,development,production,andsalesofCentronicconnectors
5
类别:板至板-接头,插座,母插口,描述:CONNRECEPT24POSVERTDUAL30AU,系列:AMPMODU系统50,制造商:TEConnectivity,连接器类型:插座,针脚数:24,加载的针脚数:全部,间距:0.050(1.27mm),排数:2,排距:0.100(2.54mm),堆叠高度111配接222:-,板上高度:0.350(8.89mm
RedteaMobile
ExploreRedteaMobile
Roboergo
Roboergo:EmpoweringHumanityThroughIntelligentMotion.
7
类别:芯片电阻-表面安装,描述:RES2.05KOHM1/16W0.1%0402,系列:CPF,Neohm,制造商:TEConnectivity,电阻333Ω444:2.05k,功率333W444:0.063W,1/16W,成分:薄膜,特性:-,温度系数:卤25ppm/掳C,容差:卤0.1%,封装__外壳:0402(1005公
汽车连接器
专注连接器的B2B平台,为汽车连接器行业的生产商,线束厂,整车厂,贸易商服务,让汽车连接器的研发、生产、采购、销售变得更高效,更便捷,更经济。ACH以供应和采购为核心功能,通过专业团队运作,不断完善客户体验,逐步优化汽车连接器行业B2B电子商务的业务模式。
1879283
类别:芯片电阻-表面安装,描述:RES470KOHM1/2W1%MELF,系列:SMA,Neohm,制造商:TEConnectivity,电阻333Ω444:470k,功率333W444:0.5W,1/2W,成分:薄膜,特性:-,温度系数:卤100ppm/掳C,容差:卤1%,封装__外壳:MELF,0207,供应商器件封装:02
AMM22DTMT
类别:CardEdge,EdgeboardConnectors,描述:CONNEDGECARD44POSR/A.156,系列:-,制造商:SullinsConnectorSolutions,卡类型:非指定-双边,公母:母头,位__盘__排数:22,针脚数:44,卡厚度:0.125(3.18mm),排数:2,间距:0.156(3.96mm),特性:-,安装
2
类别:芯片电阻-表面安装,描述:RES1.15KOHM1/10W0.1%0805,系列:RN73,Holsworthy,制造商:TEConnectivity,电阻333Ω444:1.15k,功率333W444:0.1W,1/10W,成分:薄膜,特性:-,温度系数:卤5ppm/掳C,容差:卤0.1%,封装__外壳:0805(2012
Optical
ShenzhenSOPOOpticalCommunicationsCo.,Ltd.,foundedin2013,hasitsheadquarterinHongKongandoperatesamodernfactoryinmainlandChina,withclientsspreadNorthAmerica,Asia,NorthernEurope,andEasternEurope.
SOPOisdedicatedtotheproductionandsalesofhigh-qualityopticalpassivecomponents,withmainproductsincludingopticalisolators,fibercollimators,WDMs,PLCsplitters,fastconnectors,opticalswitch,andopticalcirculators,whilecontinuouslyexpandingitsproductlinetoincludeMPOpatchcord,opticalfibercables,mediaconverter,andSFPopticalmodulestomeetmarketdemandsandcompany
Horn
ChengduMicroemTechnologyCo.,Ltd.isaChinesehigh-techcompanyspecializingindesigning,manufacturing,anddevelopingMicrowaveproductssuchasantennas,RF/MicrowaveComponents,andpassivecomponents.
The
Meekaam,thefirstindustrialsourcingplatformfromChina,connectsoverseasbuyerswithtop1%manufacturersfromCantonFair,ensuringcompetitivesupplychains.
53015
类别:矩形-接头,公引脚,描述:CONNHEADER2MM7POSRTANGTIN,系列:MicroBlade53015,制造商:MolexConnectorCorporation,触头类型:公形引脚,连接器类型:接头,有罩,针脚数:7,加载的针脚数:全部,间距:0.079(2.00mm),排数:1,排距:-,触头配接长度:0.122
果果查询,iphone,ipad,icloud
果果查询,iphone,ipad,icloudclean,simlock,icloud,warranty,wifi,autoapiconnect,directsource
GLF
类别:模块,描述:ASSEMBLY6POSITION4CONTACT,系列:-,制造商:I.O.Interconnect,电缆类型:扁平,直线缆,连接器类型:插头至插头,安装类型:自由悬挂,针脚__触头数:6p4c(RJ11,RJ14),长度:14.0’(4.30m),屏蔽:无屏蔽,颜色:银,特性:-,样式:反向
RF
RF-star,aforerunnerinwirelessIoTarena,hasthevisionofaconnectedworldwithwidelydeployedIoTtechnology,suchasBLE,Wi-Fi,LoRa,ZigBeeandSub-1GHz.
282842
类别:接线板-线至板,描述:TERMBLOCKRCPT4POSVERT10MM,系列:Buchanan,制造商:TEConnectivity,级别数:1,每级针脚数:4,间距:0.394(10.00mm),配接方向:水平,带板,电流:17.5A,电压:600V,线规:12-30AWG,安装类型:通孔,电线端接:螺钉-提升笼式夹,特性:联锁(侧面),颜色:绿,
3
类别:芯片电阻-表面安装,描述:RES82.0OHM1W5%2512,系列:CRG,Neohm,制造商:TEConnectivity,电阻333Ω444:82,功率333W444:1W,成分:厚膜,特性:-,温度系数:卤200ppm/掳C,容差:卤5%,封装__外壳:2512(6432公制),供应商器件封装:2512,大小__尺
东莞市吉喆合电子科技有限公司
东莞市吉喆合电子科技有限公司,专业生产排针排母连接器、简牛牛角、圆孔排针排母、IC母座、针座、housing、terminal、OBD连接器、FPC连接器、USB连接器、光伏连接器,汽车连接器、新能源连接器、连接器配套成品线,拥有“J&LConnector”品牌商标,公司拥有2000平方的生产基地,是一家集研发、生产加工、销售服务为一体的工厂企业。
1625883
类别:通孔电阻器,描述:RES4.70KOHM1W1%AXIAL,系列:ROX,Neohm,制造商:TEConnectivity,电阻333Ω444:4.7k,功率333W444:1W,成分:金属氧化物薄膜,特性:耐燃,温度系数:卤300ppm/掳C,容差:卤1%,封装__外壳:轴向,供应商器件封装:轴向,大小__尺寸:0.138直径
HSM36DRKI
类别:CardEdge,EdgeboardConnectors,描述:CONNEDGECARD72POSDIP.156SLD,系列:-,制造商:SullinsConnectorSolutions,卡类型:非指定-双边,公母:母头,位__盘__排数:36,针脚数:72,卡厚度:0.062(1.57mm),排数:2,间距:0.156(3.96mm),特性:-,
testr
spcializesindevelopingandmanufacturingOpticalFiberPatchCord,FiberPigtail,FiberConnector,Fastcpnnector,OpticalFiberAdapter,Splitter,Attenuator,Opticcommunicationaquipment,Opticcableetcfinishedproductsandsparepartsrelated.Ourproductswidelyapplyincommmunicationfields,suchasChinaMobile
1
类别:存储器-直插式模块插口,描述:CONNSOCKET240POSVERTFBDIMM,系列:-,制造商:TEConnectivity,连接器样式:FB-DIMM,针脚数:240,存储器类型:DDR2FBDRAM,标准:MO-256,安装类型:通孔,特性:板锁,锁存器,安装特性:-,包装:散装,触头镀层:金,触头镀层厚度:30碌in(0.76&micr